Scope
Reference
OUPA11504
Description
As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing.
Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation.
Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation.
Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation.
Cost
Phase 1: £220,000
Phase 2: £250,000
Phase 3: £350,00
Total: £820,000
Contract 1. Silicon Wafers for Test Chips
Supplier
Contract value
- 220000 EUR excluding VAT
- 220000 EUR including VAT
Above the relevant threshold
Award decision date
4 July 2025
Standstill period
- End: 16 July 2025
- 8 working days
Earliest date the contract will be signed
17 July 2025
Contract dates (estimated)
- 18 July 2025 to 31 January 2026
- Possible extension to 1 October 2029
- 4 years, 2 months, 15 days
Description of possible extension:
Extension End Date:
Phase 2: March 2028
Phase 3: September 2029
Main procurement category
Goods
CPV classifications
- 38000000 - Laboratory, optical and precision equipments (excl. glasses)
Contract locations
- UKC - North East (England)
- UKD - North West (England)
- UKE - Yorkshire and the Humber
- UKF - East Midlands (England)
- UKG - West Midlands (England)
- UKH - East of England
- UKI - London
- UKJ - South East (England)
- UKK - South West (England)
Procedure
Procedure type
Direct award
Supplier
XFAB
- Public Procurement Organisation Number: PLGZ-1483-CXTX
1 Silicon Drive, Sama Jaya Free Industrial Zone, Kuching
Sarawak
93350
Malaysia
Email: KCH-Customer-Service-Group@xfab.com
Website: https://www.xfab.com/
Small or medium-sized enterprise (SME): No
Voluntary, community or social enterprise (VCSE): No
Supported employment provider: No
Public service mutual: No
Contract 1. Silicon Wafers for Test Chips
Contracting authority
THE OPEN UNIVERSITY
- Charity Commission (England and Wales): RC000391
- Public Procurement Organisation Number: PYNW-6296-ZJQQ
Walton Hall
Milton Keynes
MK7 6AA
United Kingdom
Email: finance-tenders@open.ac.uk
Region: UKJ12 - Milton Keynes
Organisation type: Public authority - sub-central government