Silicon Wafers for Test Chips
- THE OPEN UNIVERSITY
Procurement identifier (OCID): ocds-h6vhtk-055960
Description
As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing.
Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation.
Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation.
Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation.
Cost
Phase 1: £220,000
Phase 2: £250,000
Phase 3: £350,00
Total: £820,000
Notices
UK6: Contract award notice
- Notice identifier
- 2025/S 000-037553
- Published
- 4 July 2025, 4:22pm
UK5: Transparency notice
- Notice identifier
- 2025/S 000-037530
- Published
- 4 July 2025, 3:42pm