Scope
Reference
OUPA11504
Description
As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing.
Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation.
Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation.
Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation.
Cost
Phase 1: £220,000
Phase 2: £250,000
Phase 3: £350,00
Total: £820,000
Contract 1. Silicon Wafers for Test Chips
Supplier
Contract value
- 820000 EUR excluding VAT
- 820000 EUR including VAT
Above the relevant threshold
Earliest date the contract will be signed
18 July 2025
Contract dates (estimated)
- 18 July 2025 to 31 January 2026
- Possible extension to 1 October 2029
- 4 years, 2 months, 15 days
Description of possible extension:
Extension End Date:
Phase 2: March 2028
Phase 3: September 2029
Main procurement category
Goods
CPV classifications
- 38000000 - Laboratory, optical and precision equipments (excl. glasses)
Other information
Conflicts assessment prepared/revised
Yes
Procedure
Procedure type
Direct award
Direct award justification
Single supplier - technical reasons
The following conditions are met in relation to the public contract-
a) due to an absence of competition for technical reasons, only a particular supplier can supply the goods, services or works required, and
b) there are no reasonable alternatives to those goods, services or works.
Teledyne-e2v have previously performed a competitor analysis and based on a comparison of price and technical performance, XFAB were selected as the preferred supplier for all their silicon chip products. As a result, Teledyne's CMOS imaging device design and manufacturing plans for this project have been developed to align with XFAB's design rules and processes. Consequently, in order to meet the requirements of the ESA agreement the OU must procure wafers from XFAB to ensure compatibility with Teledyne's design and manufacturing standards.
Supplier
X-FAB
- Public Procurement Organisation Number: PLGZ-1483-CXTX
1 Silicon Drive, Sama Jaya Free Industrial Zone, Kuching
Sarawak
93350
Malaysia
Telephone: +6082354888
Email: michael.rome@xfab.com
Small or medium-sized enterprise (SME): No
Voluntary, community or social enterprise (VCSE): No
Contract 1. Silicon Wafers for Test Chips
Contracting authority
THE OPEN UNIVERSITY
- Charity Commission (England and Wales): RC000391
Walton Hall
Milton Keynes
MK7 6AA
United Kingdom
Email: finance-tenders@open.ac.uk
Region: UKJ12 - Milton Keynes
Organisation type: Public authority - sub-central government