Scope
Reference
4915/DM/25
Description
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
Total value (estimated)
- £380,000 including VAT
Above the relevant threshold
Contract dates (estimated)
- 2 March 2026 to 31 March 2026
- 30 days
Main procurement category
Goods
CPV classifications
- 38000000 - Laboratory, optical and precision equipments (excl. glasses)
Contract locations
- UKE32 - Sheffield
Engagement
Engagement deadline
26 November 2025
The engagement was carried out before this notice was published.
Engagement process description
Indicative quotations for budgetary purposes, were sought from two potential providers in November 2025, by one of the academic members of staff team at the University.
Participation
Particular suitability
- Small and medium-sized enterprises (SME)
- Voluntary, community and social enterprises (VCSE)
Submission
Publication date of tender notice (estimated)
16 December 2025
Contracting authority
UNIVERSITY OF SHEFFIELD
- Companies House: RC000667
- Public Procurement Organisation Number: PXDP-7327-GWHT
Firth Court, Western Bank
Sheffield
S10 2TN
United Kingdom
Email: procurement@sheffield.ac.uk
Website: https://www.sheffield.ac.uk/
Region: UKE32 - Sheffield
Organisation type: Public authority - sub-central government