Supply, Delivery and Installation of Matrix Plasma Asher
- University of Strathclyde
Procurement identifier (OCID): ocds-h6vhtk-06dd5c
Description
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore.
Description
The University of Strathclyde has a requirement for a Matrix Plasma Asher.
Notices
F02: Contract notice
- Notice identifier
- 2026/S 000-074565
- Published
- 6 August 2026, 10:48am